PCB Design and Assembly Service
Delivery term:The date of payment from buyers deliver within days- Price:
Negotiable
- minimum:
- Total supply:
- Delivery term:
The date of payment from buyers deliver within days
- seat:
Guangdong
- Validity to:
Long-term effective
- Last update:
2019-07-06 13:00
- Browse the number:
410
- Shenzhen Jingxin Electronic Technology Co., Ltd. By certification [File Integrity]
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Contact:
jingxin2019(Mr.)
- Email:
- Telephone:
- Phone:
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Area:
Guangdong
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Address:
F2 Building 13, Building 17 Hongfa Industrial Park, Tangtou Road, Shiyan, Baoan District, Shenzhen, China.
- Website: http://www.pcbassemblyems.com/ http://jingxin2019.househunterssouthwest.com/
Product details
About Us
Shenzhen Jingxin Electronic Technology Co., Ltd. (JXE) is a 16-year professional company dedicating to PCB and PCBA products, providing world-class electronics manufacturing services and OEMs. Since foundation of 2002, with a spirit of specialty, the company has accumulated a group of engineering team and procurement team with more than 10 years professional experience.
We provide one-stop integrated manufacturing service from professional engineering service→PCB manufacture→component purchase→ supply chain management→PCBA manufacture→assembly, aging test to maintenance and development.
PCB Assembly Services
PCB design and assembly service
Quick-turn prototype assembly
Turn-key assembly
Partial turn-key assembly
Consignment assembly
RoHS compliant lead-free assembly
Non-RoHS assembly
Conformal coating
Final box-build and packaging
PCB Assembly Process
Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing
Testing Services
X-Ray (2-D and 3-D)
BGA X-Ray Inspection
AOI Testing (Automated Optical Inspection)
ICT Testing (In-Circuit Testing)
Functional Testing (at the board & system level)
Flying Probe
Capabilities
Surface Mount Technology / Parts (SMT Assembly)
Through-Hole Device / Parts (THD)
Mixed Parts: SMT & THD assembly
BGA / Micro BGA / uBGA
QFN, POP & lead-less chips
2800 pin-count BGA
0201 / 1005 passive components
0.3 / 0.4 Pitch
PoP Package
Flip-chip under-filled CCGA
BGA Interposer / Stack-up and more…
http://www.pcbassemblyems.com/
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